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Journal of Semiconductors(2011年12期)
半導(dǎo)體學(xué)報(英文版)

  • 基本信息
  • 半導(dǎo)體學(xué)報(英文版);半導(dǎo)體學(xué)報;Chinese Journal of Semiconductors

    中國科學(xué)院半導(dǎo)體研究所;中國電子學(xué)會

    月刊

  • 1674-4926

    11-5781/TN

    北京市

    英文;

    大16開

    2-184

    1980

  • 出版信息
  • 信息科技

    無線電電子學(xué)

    9844篇

  • 1044468次

    41844次

  • 評價信息
  • 1.045

    0.78

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    1992年(第一版),1996年(第二版),2000年版,2004年版,2008年版

    中科雙效期刊;中國科技期刊卓越行動計劃入選項目;中國最具國際影響力學(xué)術(shù)期刊;

目 錄

  • MOS Capacitance-Voltage Characteristics Ⅱ.Sensitivity of Electronic Trapping at Dopant Impurity from Parameter Variations
  • MOS Capacitance-Voltage Characteristics Ⅲ.Trapping Capacitance from 2-Charge-State Impurities
  • A kind of magnetron cavity used in rubidium atomic frequency standards
  • Neurocomputing van der Pauw function for the measurement of a semiconductor‘s resistivity without use of the learning rate of weight vector regulation
  • Peltier effect in doped silicon microchannel plates
  • Influence of morphologies on the field emission performance of oriented ZnO nano-arrays
  • Selected area laser-crystallized polycrystalline silicon thin films by a pulsed Nd:YAG laser with 355 nm wavelength
  • In situ nanoscale refinement by highly controllable etching of the(111) silicon crystal plane and its influence on the enhanced electrical property of a silicon nanowire
  • Study and modeling of the transport mechanism in a Schottky diode on the basis of a GaAs semiinsulator
  • Investigation and modeling of the avalanche effect in MOSFETs with non-uniform finger spacing
  • A 4.69-W/mm output power density InAlN/GaN HEMT grown on sapphire substrate
  • Design and optimization of linearly graded-doping junction termination extension for 3.3-kV-class IGBTs
  • A novel high-voltage device structure with an N~+ ring in substrate and the breakdown voltage model
  • Light controlled prebreakdown characteristics of a semi-insulating GaAs photoconductive switch
  • A novel 2-T structure memory device using a Si nanodot for embedded application
  • Collection efficiency and charge transfer optimization for a 4-T pixel with multi n-type implants
  • A dual-mode analog baseband with digital-assisted DC-offset calibration for WCDMA/GSM receivers
  • A transformer-loaded receiver front end for 2.4 GHz WLAN in 0.13μm CMOS technology
  • A new low-voltage and high-speed sense amplifier for flash memory
  • A novel power amplifier structure for RFID tag applications
  • Harmonic-suppressed quadrature-input frequency divider for OFDM systems
  • A 5 GHz 7.2 dB NF low power direct conversion receiver front-end with balun LNA
  • Continuous time sigma delta ADC design and non-idealities analysis
  • A low power mixed signal DC offset calibration circuit for direct conversion receiver applications
  • A 750 MHz semi-digital clock and data recovery circuit with 10~(-12) BER
  • 12.5 Gbps 1:16 DEMUX IC with high speed synchronizing circuits
  • Improvement of the field emission properties of carbon nanotubes by CNT/Fe_3O_4 composite electrophoretic deposition
  • Wafer back pressure control and optimization in the CMP process
  • Journal of Semiconductors Volume 32 2011 CONTENTS
  • Author Index to Volume 32
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